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| VDS * * * * * * Tjmax G G TC TC tp VDD Tjmax EAR VDD Tjmax 5) Tjmax 15 VGS VGS Ptot Gate source voltage Rev. 2.5 P 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A V DS Tj RthJC RthJA wavesoldering V(BR)DSS V GS V GS VGS VDS V DS Tj Tj V GS V GS Tj Tj VDS VGS RG Rev. 2.5 P 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A Tj Transconductance Input capacitance Output capacitance Reverse transfer capacitance g fs Ciss Coss Crss V DS V GS f V DS V GS V DS Turn-on delay time Rise time Turn-off delay time Fall time td(on) tr td(off) tf V DD V GS RG Gate to source charge Gate to drain charge Qgs Qgd VDD VDD VGS VDD EAR f Coss Coss VDS VDS 5I <=I , di/dt<=400A/us, V SD D DClink=400V, Vpeak P 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A Tj TC Inverse diode direct current, pulsed ISM VGS Reverse recovery time Reverse recovery charge Peak reverse recovery current trr Qrr Irrm VR diF/dt Rev. 2.5 P 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A TC TC Ptot TC VDS VDS TC VDS tp Rev. 2.5 P 8 02-11 Please note the new package dimensions arccording to PCN 2009-134-A tp tp VDS Tj VGS tp VDS VDS Tj VGS f Tj V GS VDS Rev. 2.5 P 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A VGS Tj VGS VGS VGS VDS max IF VDS max Rev. 2.5 P 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A Tj Tj V DD Tj Tj Tj V(BR)DSS Tj f E AR V(BR)DSS Tj Rev. 2.5 P f 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A Coss VDS V GS f VDS VDS VDS Rev. 2.5 P 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A G Rev. 2.5 P 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A Published by Infineon Technologies AG 81726 Munich, Germany (c) 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.5 P 8 02 11 Please note the new package dimensions arccording to PCN 2009-134-A Data sheet erratum PCN 2009-134-A New package outlines TO-247 1 New package outlines TO-247 Assembly capacity extension for CoolMOSTM technology products assembled in lead-free package PG-TO247-3 at subcontractor ASE (Weihai) Inc., China (Changes are marked in blue.) Figure 1 Outlines TO-247, dimensions in mm/inches Rev. 2.0, 2010-02-01 Final Data Sheet Erratum |
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